Qmobile i2 pro kingston emmc repaired

HardGSM

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VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x70 (Kingston)
Product name: EH8EE8 (0x454838454538), rev: 0x01, serial number: 0x0A5CA01D
Manufacturing date: Feb 2017
CID: 70010045 48384545 38010A5C A01D24E4
CSD: D04F0132 0F5903FF FFFFFFEF 8A400060
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 7.13 GiB(7,650,410,496 bytes)
Cache size: 512 KiB
Partition configuration: 0x08
No boot acknowledge is sent (default)
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
EXT_CSD backup saved to "\\%BACKUPS%\EH8EE8_0A5CA01D.ext_csd"
Internal storage: 4.49 GiB
crypto state: unencrypted
ANDROID ROM info:
platform: sc8830, cpu abi: armeabi-v7a
manufacturer: QMobile
board: i2 PRO, name: i2_PRO
brand: QMobile, model: QMobile i2 PRO
build id: LMY47D, version: 5.1 Lollipop (QMobile_i2_PRO_MP_05_12)
build description: sp7731gea_hdplus_dt-user 5.1 LMY47D 69 release-keys
 
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